Mikrowave Packaging

In microwave packaging, primarily FBH's semiconductor chips are processed with main focus on packing of rf power components. Beside this, packing of MMICs is realized up to the mm-wave region.

Key aspects in packaging of rf power transistors are:

Thermal management of power transistors (low thermal resistivity)

• Housings for high power and high frequencies (high current, low parasitics) at the same time
• High electrical stability (reduction of oscillations)
• Wire bonding for high currents

The following technologies are available:

• UV Laser for drilling, cutting, scribing, labeling
• Flip-chip bonding with FC150 by Süss
• Plasma etching
• Wire and tape bonding with semi and full automatic bonding tools