Laser Technology

The Laser Technology Group runs established processing lines for ridge waveguide lasers (RW), broad area laser diodes (BA), tapered laser diodes and bars. The epitaxial structures are processed on 2" and 3" wafers. Additionally internal grating structures can be applied for frequency stabilized laser diodes.

• Contact and projection lithography including periodical structures starting at 500 nm
• Holographic lightning for small grating periods (140 nm .. 400 nm)
• Wet chemical etching or reactive ion etching for lateral waveguiding
• Ion beam sputtering or PECVD for isolators
• Evaporation and sputter processes for contact metals
• Electroplating of gold
• Back end process (thinning, scribing and breaking)
• Passivation of semiconductor surfaces
• Facet processing (antireflection and high reflection coating)