Process Technology

The FBH process line handles wafers with diameters ranging from 2" to 4" and different types of substrates such as GaAs, InP, Si, SiC, glass and others with high reproducibility. Therefore the process line is considered to be very flexible. Due to the modern and industry-compatible process equipment FBH is able to conduct process developments with fast turn-around times. We carry out custom-made complete processes up to small-scale series fabrication and transfer process modules to external partners.

The process line consists of all enabling technologies for chip manufacturing from structuring and deposition techniques techniques to chip dicing.