Backend

The group "Backend & Process Control Measurements" bridges the front-end processing of full wafers with the packaging of single chips. After dc characterisation, a back side process can be carried out to establish the desired functionality. Wafer dicing follows.

Process modules

• Laser micro processing
• Back-side thinning
• Back-side process RF devices

DC Device Characterization

Wafer seperating techniques

• Dicing
• Scribe and break