Dicing

Separation of the wafer into dices with either devices or integrated circuits by cut-off grinding.

Standard methods

• Dicing of GaAs, Saphir, SiC, Al₂O₃, Si, quartz glass etc.
• Machining of different wafer sizes (2", 3", 4" and 6" wafers as well as parts of these wafers)
• Ability to supply "ready for pick and place" in standard dicing frames (e.g. Disco MODTF 2-5-1 or 2-6-1)