Ion Implanter
Ion Implanter: Seperator with Ion Source and Pre-Accelerator
Ion Implanter
Ion Implanter: Beam Line, Neutral Particle Trap and Wafer Chamber

Implantation

The aim of ion implantation is to modify the properties of the target material. Penetrating ions change the electrical and mechanical properties of the implanted area. The penetration depth and the lateral and vertical distribution of the ions can be simulated by Monte Carlo Simulation.

Technology:

  • Implantation energies from 15 keV to 400 keV
  • Implantation sources for gases, liquids and solid materials up to 250 amu
  • Activation of the implantation by thermal treatment (Rapid Thermal Annealing)
  • Lateral structuring by photo resists
Simulated Distribution of C-Implantation in Al-Ti-SiN
Simulated Distribution of C-Implantation in Al-Ti-SiN, Implantation Dose 4x1014cm-2, 370 keV

Contact

Dr. Andreas Thies
 Phone +49.30.6392-3297
 Fax +49.30.6392-2685
 Email andreas.thies(at)fbh-berlin.de