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Images for download

Logo

Logo (jpg, rgb modus) of Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik. Please contact our public relations office in case you need further formats.

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Ferdinand-Braun-Institut - Main Entrance

© FBH/schurian.com

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Metal Organic Vapor Phase Epitaxy (MOVPE) - Planetary Reactor

© FBH/schurian.com
Multi-wafer reactor for Metal Organic Vapor Phase Epitaxy (MOVPE) of gallium nitride. Substrate wafers are put inside a sluice and seperately placed into the reactor. During this first step on its way to the final device atomic-thin layers are deposited onto the substrate material (= wafer).

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Plasma Etching in the Cleanroom

© FBH/P. Immerz
Dry etching technique that is used, for example, in semiconductor technology to remove material in a controlled manner. Defined parts of the substrate are therefore coated with a material such as photoresist – these parts withstand the subsequent etching process unharmed. This process allows to realize structures in the millimeter range and below.

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Microtechnologist in the Cleanroom

© FBH/schurian.com
A microtechnologist mounting laser stacks – such diode lasers deliver specifically high output powers as, for example, required for materials processing.

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Wafer with Laser Diodes

© FBH/schurian.com
Completely processed 3" wafer with laser diodes.

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On-wafer Microwave Measurement

© FBH/schurian.com
Measurement of single circuits with special probe tips, which only insignificantly distort the RF properties of the circuits. The distance of the contacts is usually in the range of only 50-150 micrometer.

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GaN Wafer with HEMT Transistors

© FBH/schurian.com
High electron mobility transistors (HEMT) based on gallium nitride hetero structures (GaN) on 2" silicon carbide substrates (SiC). The transistors are developed for next-generation equipment in mobile communications and further applications.

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New generation of Laser Diodes

© FBH/schurian.com
Design improvements led to enhanced broad area lasers featuring high output powers and high efficiencies at the same time – up to now, high output powers usually came along with a significantly poorer efficiency (conversion efficiency of electrical into optical power).

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Diode Laser Module für Display Technology

© FBH/schurian.com
Compact and highly efficient diode laser module emitting in the green blue spectral range, specifically well-suited for applications in display technology.

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Smaller than a Matchbox: Microsystems Light Source for Precision Mesurements

© FBH/schurian.com
This hybrid-integrated MOPA module (master oscillator power amplifier) offers excellent spectral stability and high output power. It is thus well-suited for applications such as coherent optical free-space communications and for high-precision measurements in space.

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ps Light Source with Integrated Pulse Picker

© FBH/schurian.com
This picosecond light source with hybrid-integrated electronics combines FBH’s competencies from optoelectronics and microwave technology. Such laser sources based on diode lasers offer a high application and market potential in materials processing, sensors and analytics.

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Energy Efficient Class S Amplifier for Mobile Communications

© FBH/schurian.com
Innovative, digital amplifier concept which delivers international record values and significantly reduces energy demand of wireless LAN and base stations in mobile communications. The module is based on a gallium nitride switching amplifier IC (integrated circuit).

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Gallium Nitride (GaN) Power Amplifier

© FBH/schurian.com
Monolithic integrated GaN power amplifiers for the X-band range, mounted as a modules. Such amplifiers are attractive for a great variety of applications in radar and satellite communication.

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Compact Microwave Plasma Source at Atmospheric Pressure

© FBH/schurian.com
The Ferdinand-Braun-Institut developed a novel plasma source with which air can be "ignited" generating a cold flame. Prospectively, this source shall be used, for example, for the treatment of skin diseases. Additionally, adhesion of surfaces can be improved as, for example, required to prepare surfaces for bonding and varnishing.

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Light Emitting Diode (LED) in the Ultraviolet Spectral Range

© FBH/schurian.com
Flip-chip mounted LED emitting in the ultraviolet (UV) spectral range. Such LEDs shall be used for water purification and gas sensors in the future.

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Prof. Dr. Günther Tränkle

© FBH/Katja Bilo
Director of Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik

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Prof. Dr. Günther Tränkle

© FBH/Katja Bilo
Director of Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik

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