Source: IEEE Microwave Magazine, March/April 2017, Cover Feature, p. 74 ff.

Tight Focus Toward the Future

The push to conquer the sparsely used electromagnetic spectrum between 100 and 1,000 GHz, commonly known as the millimeter-wave (mmW) and sub-mmW regions, is now in full force. The current rapid development of electronic circuits and subsystems beyond 100 GHz is enabled by improvements in high-frequency semiconductor technology and packaging techniques. In this article, we highlight recent advances we have developed in heterogeneous semiconductor-material chip integration for application toward the mmW frequency bands - in essence, a wafer-level integration approach that replaces chip-to-chip connections with monolithic integration.