Process Technology Department

The very flexible FBH process line handles wafers with diameters ranging from 2" to 4" and different types of substrates such as GaAs, InP, Si, SiC, sapphire, GaN and others with high reproducibility. Due to the modern and industry-compatible process equipment FBH is able to develop processes with fast turn-around times. The Process Technology Department carries out custom-made complete processes up to small-scale series fabrication and transfers process modules to external partners.

All technology steps required for chip manufacturing ranging from lithography, deposition, and etching to chip dicing are available in the process line.

  • GaAs wafer with diode lasers
    [+] 2", 3" and 4" GaAs wafer with diode lasers
  • InP-on-SiGe-BiCMOS wafer
    [+] Detail of a 3" InP-on-SiGe-BiCMOS wafer