Materials Analytics - Layer and Structure Analysis

The FBH offers its customers comprehensive know-how and a wide range of technical resources in material analytics. The institute provides a broad spectrum of measurement techniques and equipment on the highest technical level. Services in this area of expertise are often demanded to solve complex problems in materials characterization. In detail, the FBH provides the following analytical methods:

• X-Ray diffraction
  • High-resolution X-Ray diffractometer for precise determination of composition and layer thickness (Philips MRD, Philips Xpert Pro)
  • Spatially-resolved X-Ray mapping for substrate and layer characterization (Philips DCDM)
    
    
• Luminescence (Photoluminescence (PL), Electroluminescence (EL))
  • RT-PL mapping for determination of emission wavelength and composition homogeneity (Accent PLM 150)
  • Spectral reflectance mapping for the determination of layer thickness (homogeneity) and DBR mirror characteristics
  • Low-temperature PL (15 K) for analysis of materials quality
  • Time-resolved PL (> 1 ns) for analysis of materials quality
  • Electroluminescence for determination for emission wavelength of LEDs and laser diodes
    
    
• Carrier concentration
  • Electro-chemical C-V-measurement of carrier concentration profiles (Accent ECV Pro, Accent PN 4300/4400)
  • Hall effect measurements for determination of carrier concentration and mobility (temperature dependent, magnetic field dependent)
    
    
• Electron microscopy
  • Scanning electron microscopy for surface analysis and measurement of layer thickness (high-resolution LEO Gemini, JEOL 840)
  • Cathodoluminescence (77 K) for spatially-resolved measurement of luminescence intensity and wavelength and for defect characterization
  • EDX (electron microprobe) for composition determination
  • EBIC (electron beam induced current) for determination of p-n-junction position
  • Sample preparation for SEM and TEM (cross section, angled polishes, plan-view samples)