Process Modules

Since many years, FBH successfully provides external customers with handling services of individual process steps and process modules in the institute's flexible and industry-compatible III-V compound semiconductors process line:

Basic parameters

• Equipped process line for microwave and optoelectronic components
• Wafer sizes 4 ", 3" and 2 "wafers and cuts; FS-to-BS adjustment
• Special equipment in the process line
  • I-line wafer stepper
  • Electron beam exposure
  • Laser Micromachining plant
  • RIE and ICP etching tools
  • Implanter

Target groups

• Supporting your production of high-level components by individual processes and process modules
  • Volumes up to 50 wafers per week
  • Short wafer return times by order processing in a two-shift system
  • Certification of the process line according to ISO 9001 (quality), 14001 (environmental), and 18001 (occupational safety); qualified supplier for numerous SMEs
    
    
• Research / development / prototyping
  • Proven FBH standard processes as good starting parameters for a process development
    
  • Flexible line process allows for easy enlargement of the wafer diameter after completion of development
    
  • Customer support with engineering services (e.g. simulation, process development according to customer's needs)

Examples

• PECVD SiNx deposition on customer's wafers, volume typ. 10 wafers per quarter
• Ridge structuring of RW and BS-wafers, volume typ. 10 wafers per month
• Dicing of special wafers for X-ray lithography, volume typ. 2 wafers per month
• Metallization of wafers for optical measurement technology, volume typ. 50 wafers per quarter