Separation of the wafer into dies with either devices or integrated circuits by cut-off grinding.
- Dicing of GaAs, Saphir, SiC, Al2O3, Si, quartz glass etc.
- Machining of different wafer sizes (2", 3", 4" and 6" wafers as well as parts of these wafers)
- Ability to supply "ready for pick and place" in standard dicing frames (e.g. Disco MODTF 2-5-1 or 2-6-1)