Low-cost eWLB packaging for automotive radar MMICs in the 76-81 GHz range

J. Böck1, M. Wojnowski1, C. Wagner2, H. Knapp1, W. Hartner3, M. Treml2, F.-J. Schmückle4, S. Sinha4 and R. Lachner1

Published in:

Int. J. Microwave Wireless Technolog., vol. 5, no. 1, pp. 25-34 (2013).

Copyright © Cambridge University Press 2013. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the Cambridge University Press.

Abstract:

Embedded wafer-level ball grid array (eWLB) is investigated as a low-cost plastic package for automotive radar applications in the 76-81 GHz range. Low transmission losses from chip to package and board are achieved by appropriate circuit and package design. Special measures are taken to effectively remove the heat from the package and to optimize the package process to achieve automotive quality targets. A 77 GHz radar chip set in eWLB package is developed, which can be applied on the system board using standard solder reflow assembly. These radar MMICs provide excellent radio frequency (RF) performance for the next generation automotive radar sensors. The potential for even higher system integration is shown by a radar transceiver with antennas integrated in the eWLB package. These results demonstrate that eWLB technology is an attractive candidate to realize low-cost radar systems and to enable radar safety affordable for everyone in the near future.

1 Infineon Technologies AG, Am Campeon 1-12, 85579 Neubiberg, Germany
2 Danube Integrated Circuit Engineering, Freistädter Straße 400, A-4040 Linz, Austria
3 Infineon Technologies AG, Wernerwerkstraße 2, 93049 Regensburg, Germany
4 Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik, Gustav-Kirchhoff-Straße 4, D-12489 Berlin, Germany