In the front-end of line all process modules for the production of components at wafer level are realized. The flexible process line in clean room environment of up to class ISO 5 allows for processing of wafers in a batch of different sizes and retail operations. Wafers are processed using automated processing equipment.

  • GaN X-band MMICs after front-end process
    [+] GaN X-band MMICs after front-end process
  • Wafer with GaN laser diodes
    [+] 2" wafer with GaN laser diodes

The following standard process modules are available:

  • Photolithography, Electron beam lithography
  • Etching techniques
  • Deposition methods
  • Ion implantation
  • DC-measurements